लैमिनेशन पीसीबी

लैमिनेशन PCB एक एक कोर घटक इलेक्ट्रॉनिक उत्पादों का 2c जो कसकर विभिन्न इलेक्ट्रॉनिक घटकों से फॉर्म a पूर्ण सर्किट से जुड़ता है. A मुद्रित सर्किट बोर्ड a दबाने प्रक्रिया को संदर्भित करता है a बहु-परत सर्किट बोर्ड जो a प्रक्रिया पीक दबाव और उच्च तापमान से बॉन्ड विभिन्न कॉपर परतों का उपयोग करता है प्रक्रियाएं इन इलेक्ट्रॉनिक उद्योग।

Lamination process is a common manufacturing process for boards, which utilizes the mechanical effects of high temperature and high pressure to compress multi-layer printed circuit board materials into one piece, thus making complex printed circuit boards.

विशेषताs of the board:

1. मल्टीलेयर डिज़ाइन: यह प्रोसेस मैनुफैक्चर मल्टी-लेयर सर्किट बोर्ड्स%2सी जिसका अर्थ कि कई सिंगल-लेयर सर्किट बोर्ड मैटेरियल्स एक साथ दबाया जा सकता है टू फॉर्म ए मल्टी-लेयर प्रिंटेड सर्किट बोर्ड. इस में सिंगल-लेयर प्रिंटेड सर्किट बोर्ड से अधिक घनत्व और जटिलता है सिंगल-लेयर प्रिंटेड सर्किट बोर्ड.

2. Better electrical performance: By pressing multiple layers of printed circuit boards together, the overall layout of the printed circuit board exhibits the characteristics of multiple complex layers, thus providing stronger electrical performance. This is not only applicable to small boards, but also to the manufacturing of large electrical products.

3. High reliability: Compared with traditional single-layer circuit boards, multi-layer laminated boards have more stability and reliability. This means that it can be used as a manufacturing material for high-performance electronic products.

4. उच्च घनत्व: का लाभ लैमिनेशन प्रक्रिया यह है कि यह निर्माण मुद्रित सर्किट बोर्ड पारंपरिक मुद्रित सर्किट बोर्डों की तुलना में उच्च घनत्व के साथ।

Pressing process is an important process for improving the density and performance of printed circuit boards. It can manufacture complex and high-performance multi-layer printed circuit boards, with advantages such as better electrical performance and high reliability.

The lamination printed circuit board has high bonding strength and electrical performance. During the pressing process, under the action of high pressure and temperature, the inner and outer copper boards can be fully bonded, with higher strength and difficulty in peeling. This is an important characteristic that printed circuit boards must possess when used, which can ensure that printed circuit boards will not have problems such as open circuits and short circuits during long-term use, thereby improving the stability of the entire circuit system.

Layer:12

Board thickness:1.6±0.16mm

लोकप्रिय टैग: